While machining small objects, the adverse thermal effects are felt much stronger. The material removal mechanism of CW and nanosecond fiber lasers is mainly based on melting and vaporization. In this time scale, large amount of heat conduction takes place leading large HAZ (heat affected zone) formation and degrading the machining quality. For this reason, ultrafast fiber lasers with high beam quality should be used in micromachining. The main interaction mechanism of ultrafast (<10 ps) pulses with the material is ablation in which the material absorbs the pulse energy in a very short time scale, turns into plasma state and is ejected away before heat conduction could take place. When an ultrafast pulse is focused on a small point, the photon density becomes so large that it allows multi-photon absorption process and machining virtually any materials including metals, semiconductors, polymers, ceramics and glasses.